Founded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything™ targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in many of the world’s largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs.
InvenSense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy. We’re looking for top-notch innovators to join our global team. If you’re interested in being a part of our journey and helping us grow to become the leading provider of SoC platform solutions, we want to hear from you.
We ensure TDK InvenSense's success by collaborating with engineering teams (ASIC, MEMS, etc.) and developing scalable tools and infrastructure that help engineers develop, test, debug and release products quickly. We impact on the organization by increasing the pace of product development and ensuring our products are thoroughly tested and deliver the highest quality. In this role, you will bring up new hardware platforms, get engaged in the test hardware infrastructure, and new testers development.
Role Summary: Test Systems & Technology Development Engineer, Sr Staff
In this highly specialized role, you will bridge the gap between MEMS physics, analog hardware design, and software signal processing. You will be responsible for defining and building the next generation of test platforms centered on the NI PXI architecture to enable the characterization of MEMS structures before they are integrated with ASICs.
This includes designing custom hardware interfaces—such as high-precision probe cards and C2V (Capacitance-to-Voltage) emulation networks—and integrating them into a modular PXI environment to measure ultra-low signals. You will act as a technical lead, collaborating with MEMS design, ASIC design, and Product Engineering to ensure our sensor products meet the highest performance and quality standards.
Key Responsibilities
Architect and lead the development of end-to-end test systems utilizing the NI PXI platform integrated with custom-designed hardware.
Design and implement test strategies to probe MEMS-only wafers by mimicking CMOS analog chip interfaces (such as C2V networks) to capture femto-farad level signals.
Design custom PCB and probe card hardware for ultra-low capacitive measurements. Ensure seamless electrical and mechanical integration between custom test fixtures and the PXI chassis.
Develop and implement digital signal processing (DSP) algorithms (e.g., FFT, FIR, IIR) to analyze raw sensor data and perform sensor calibration.
Write robust, scalable software in C# to control PXI instrumentation and automate data acquisition and hardware testing.
Drive design-for-test (DFT) reviews and collaborate with ASIC and MEMS designers to align test hardware capabilities with future product roadmaps.
Required Qualifications
MS in Electrical Engineering, Physics, or a related field.
10+ years of experience in hardware/systems engineering, specifically within the semiconductor or MEMS industry.
hands-on experience with NI PXI systems, including chassis configuration and the use of PXI-based SMUs, oscilloscopes, and DAQ modules.
Proven track record of designing low-noise analog circuits, specifically for capacitive sensing or low-level signal conditioning.
Proficiency in board-level design tools (e.g., OrCad Capture, Allegro, Altium) and simulation tools (PSPICE).
Advanced coding skills in C# or C++ for system control, and Python or MATLAB for data analysis and algorithm development.
Demonstrated academic or work experience in digital signal processing (DSP).
Preferred Skills & Experience
Direct experience with MEMS-only test development of custom probe card interfaces.
Experience with NI-LabVIEW, particularly in high-volume or high-precision test environments.
Knowledge of ASIC design fundamentals, particularly regarding charge amplifiers and ADCs.
Familiarity with version control (GIT, Bitbucket) and CI/CD pipelines.
Personal Attributes
Ability to troubleshoot complex issues that span mechanical probe interfaces, high-precision analog electronics, and software algorithms.
Exceptional critical thinking skills with a focus on solving "unsolvable" measurement challenges.
Ability to distill complex technical data into actionable insights for cross-functional stakeholders.
The compensation package offered for this position is the following:
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RAL (Gross Annual Salary) from 60K to 75K €.
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Variable compensation depending on personal and Corporate performances: of up to 35%
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Benefits: €9 meal vouchers, car parking or public transport pass, supplemental health insurance.
The salary range is relative to the specified job grade offered, which may vary based on the candidate's actual experience.
